Now in Beta

The Decision Layer for Debond-on-Demand.

Stop digging through thousands of unstructured patents. Access the first structured evidence dataset connecting Triggers, Process Windows, and Failure Modes for EV & Electronics disassembly.

Trusted by R&D teams at automotive Tier 1s.

unbond-db-query-v4.sql
Mechanism Trigger Time Result
Epoxy Vitrimer (T1) 180°C 20 min Clean Peel
Microsphere Acrylic 110°C 60 sec Pop-off
UV-Acrylate System UV 365nm 5 sec Residue > 5%
Diels-Alder Network 130°C 45 min Cohesive Fail

Built for the future of Disassembly

HENKELTECH 3MLABS TESLAR&D NORTHVOLT

Why current R&D scouting fails.

Your team spends months reading PDFs. We spent years building a structured engine.

The Thermal Gap

Academic papers promise debonding at 180°C, but your battery cells explode at 80°C. We filter specifically for realistic process windows.

Unstructured Chaos

Patents hide critical data in dense text. We extract it into searchable fields: Bondline thickness, Residue %, and T_onset.

Makers & Integrators

Whether you formulate the glue (Henkel) or recycle the pack (Redwood), we normalize the vocabulary to speak your data language.

The Pipeline

From Raw PDF to Decision Matrix

1. Input

Patents, Technical Papers, Safety Datasheets.

2. Normalization

Standardizing: Chemistry Name | Ex# | Stack-up.

3. Output

Matrix: Trigger » Condition » Outcome.

Who uses Unbond Intelligence?

Lab

For Makers (Henkel, 3M)

R&D Chemists
  • Benchmark your formula against 500+ competitors.
  • Find whitespace in the patent landscape (IP Strategy).
EV

For Integrators (EV OEMs)

Innovation Scouts
  • Find adhesives that match your line speed and T-cycle.
  • Validate recycling targets (95% recovery rate).
Circuit Board

For Recyclers

Identify chemistry inside the pack before you shred it to prevent contamination.

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